ScienceDaily: Team Invents Fast, Flexible Computer Chips On Plastic: "Team Invents Fast, Flexible Computer Chips On Plastic
New thin-film semiconductor techniques invented by University of Wisconsin-Madison engineers promise to add sensing, computing and imaging capability to an amazing array of materials.
Electrical and Computer Engineering Graduate Student Hao-Chih Yuan holds a sample of a semiconductor film on plastic. (Image courtesy of University of Wisconsin-Madison)
Historically, the semiconductor industry has relied on flat, two-dimensional chips upon which to grow and etch the thin films of material that become electronic circuits for computers and other electronic devices. But as thin as those chips might seem, they are quite beefy in comparison to the result of a new UW-Madison semiconductor fabrication process detailed in the current issue of the Journal of Applied Physics.